Light emitting apparatus and light unit

ABSTRACT

A light emitting device includes: a body including a cavity formed with a stepped section; an electrode of which one end is disposed on the stepped section and the other end is disposed outside of the body; a metal layer including a main frame and a sub frame extended from the main frame; and a light emitting diode disposed on the metal layer, wherein a bottom surface of the main frame is exposed out from a bottom surface of the body, wherein a portion of a top surface of the main frame is exposed to the cavity, and wherein an area of the top surface of the main frame is larger than an area of the bottom surface of the main frame.

This application is a continuation of co-pending application Ser. No.12/868,243 filed on Aug. 25, 2010, which claims priority to KoreanPatent Application No. 10-2009-0079029 filed on Aug. 26, 2009. Theentire contents of all of the above applications are hereby incorporatedby reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

An embodiment relates to a light emitting apparatus and a light unit.

2. Description of the Related Art

In recent years, a light emitting apparatus and a lighting system usinga light emitting device as a light source have been widely used. Thelight emitting diode (LED) may configure the light source that generatelight by using compound semiconductor materials such as GaAs-series,AlGaAs-series, GaN-series, InGaN-series, and InGaAlP-series.

Meanwhile, since the emission characteristics of the LED aredeteriorated due to heat, the light emitting apparatus and the lightingsystem that have the LED need to be designed to rapidly emit heatemitted from the LED to the outside.

SUMMARY OF THE INVENTION

Embodiments provide a light emitting apparatus and a light unit havingnew structures.

Embodiments provide a light emitting apparatus and a light unit havingimproved heat radiation characteristics.

A light emitting apparatus according to an embodiment includes: a bodyincluding a cavity; an electrode of which one end is disposed in thecavity by penetrating the body and the other end is disposed outside ofthe body; a heat radiating member including a main frame which iscoupled with the body to form the bottom of the cavity and a sub framewhich extends from the main frame, wherein the top surface of the mainframe has a larger area than the bottom surface of the main frame andthe sub frame includes a slope; and a light emitting device installed onthe heat radiating member and electrically connected with the electrode.

A light unit according to another embodiment includes: a light emittingapparatus including a body including a cavity, an electrode of which oneend is disposed in the cavity by penetrating the body and the other endis disposed outside of the body, a heat radiating member coupled withthe body, of which at least a part protrudes downwards from the bottomof the body, and a light emitting device installed on the heat radiatingmember and electrically connected with the electrode; and a substratedisposed below the light emitting apparatus, into which at least a partof the heat radiating member is inserted.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a light emitting apparatus according to a firstembodiment;

FIG. 2 is a cross-sectional view taken along line A-A′ of FIG. 1;

FIG. 3 is a cross-sectional view taken along line B-B′ of FIG. 1;

FIG. 4 is a perspective view of a heat radiating member;

FIG. 5 is a cross-sectional view of a light unit including the lightemitting apparatus;

FIGS. 6 and 7 are perspective views of a light unit including the lightemitting apparatus;

FIG. 8 is another embodiment of the light unit;

FIG. 9 is a cross-sectional view of a light emitting apparatus accordingto a second embodiment;

FIG. 10 is a cross-sectional view of a light emitting apparatusaccording to a third embodiment; and

FIG. 11 is a cross-sectional view of a light emitting apparatusaccording to a fourth embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In describing embodiments, it will be understood that when layers(films), regions, patterns, or structures are referred to as being “on”or “under” a substrate, layers (films), regions, pads, or patterns, “on”and “under” include “directly” or “indirectly”. Further, “on” or “under”will be described on the basis of the drawings.

In the drawings, thicknesses or sizes of layers are exaggerated,omitted, or schematically illustrated for convenience and clarity ofdescription. Further, sizes and actual sizes of constituent members arenot fully reflected.

Hereinafter, a light emitting apparatus and a lighting light unitaccording to embodiments of the present invention will be described indetail with reference to the accompanying drawings.

FIG. 1 is a top view of a light emitting apparatus according to a firstembodiment, FIG. 2 is a cross-sectional view taken along line A-A′ FIG.1, and FIG. 3 is a cross-sectional view taken along line B-B′ of FIG. 1.

Referring to FIGS. 1 to 3, the light emitting apparatus 1 includes abody 10 including a cavity 15, a light emitting device 20 in the body10, a first electrode 31 and a second electrode 32 of which ends aredisposed in the body 10 and which are electrically connected with thelight emitting device 20, a heat radiating member 50 thermally connectedwith the light emitting device 20, of which at least a part protrudesfrom the bottom of the body 10, and an encapsulant 40 formed in thecavity 15 to seal the light emitting device 20. The encapsulant 40 mayinclude a phosphor luminescent substance.

The body 10 may be made of any one of a ceramic material, a siliconmaterial, and a resin material. However, the material of the body 10 isnot limited.

The body 10 may be integratively formed by injection molding or may beformed by stacking a plurality of layers.

The cavity 15 of which the top is opened may be formed in the body 10.When the body 10 is formed by stacking the plurality of layers, thecavity 15 may be formed by a patterning process, a punching process, acutting process, or an etching process. Further, when the body 10 isformed by the injection molding, the cavity 15 may be formed by a metalframe made after the shape of the cavity 15.

The cavity 15 may have a cup shape, a concave vessel shape, and thelike. Further, although the surface of the cavity 15 has a circularshape, but is not limited thereto and for example, may have a polygonalshape, an oval shape, and the like.

The inner surface of the body 10 forming the cavity 15 may be formed bya vertical side or an inclined side by considering a light distributionangle of the light emitting apparatus 1. Further, as shown in thefigure, a stepped section 16 may be formed on the inner surface of thebody 10 forming the cavity 15. One end of each of the first and secondelectrodes 31 and 32 may be disposed at the stepped section 16.

Meanwhile, the stepped section 16 or/and the cavity 15 may not be formeddepending on the design of the light emitting apparatus 1 and is notlimited thereto.

The surface of the cavity 15 may be coated or applied with a materialhaving high reflecting effect, i.e., white photo solder resist (PSR)ink, silver (Ag), aluminum (Al), and the like and as a result, theemission efficiency of the light emitting apparatus 1 may be improved.

The one end of each of the first and second electrodes 31 and 32 may bedisposed in the body 10 and at least a part of the other end of each ofthe first and second electrodes 31 and 32 may be exposed through theside of the body 10.

The one end of each of the first and second electrodes 31 and 32 iselectrically connected with the light emitting device 20 and the otherend of each of the first and second electrodes 31 and 32 is electricallyconnected with a substrate (not shown) equipped with the light emittingdevice 20 to transfer electric power to the light emitting device 20.

As shown in FIGS. 1 and 2, the one end of each of the first and secondelectrodes 31 and 32 is disposed on the stepped section 16 that isformed on the inner surface of the body 10 forming the cavity 15 and theother end may be exposed through the outer bottom of the body 10.

However, the arrangement and shapes of the first and second electrodes31 and 32 may be variously changed depending on the design of the lightemitting apparatus 1. Further, a plurality of electrodes may beadditionally formed in addition to the first and second electrodes 31and 32 and the present invention is not limited thereto.

FIG. 4 is a perspective view of a heat radiating member of a lightemitting apparatus according to an embodiment.

Referring to FIGS. 1 to 4, the heat radiating member 50 includes a mainframe 51 supporting the light emitting device 20, of which at least apart protrudes on the bottom of the body 10 by penetrating the bottomsurface of the body 10 and first and second sub frames 52 and 53 thatextend from the main frame 51. However, the shape of the heat radiatingmember 50 is not limited.

The first and second sub frames 52 and 53 strongly couple the heatradiating member 50 to the body 10 and may emit heat generated from thelight emitting device 20.

However, the first and second sub frames 52 and 53 may not be formed ormay have various shapes.

The main frame 51 supports the light emitting device 20 and receives theheat generated from the light emitting device 20.

The main frame 51 includes a first part 51 a supporting the lightemitting device 20 and a second part 51 b protruding toward the lowerside from the first part 51 a.

The bottom of the first part 51 a may be disposed on the same horizontalsurface as the bottom of the body 10 and the bottom of the second part51 b is disposed below the bottom of the body 10.

The top of the first part 51 a has an area larger than the bottom of thesecond part 51 b. That is, the top surface of the main frame 51 may havean area larger than the bottom surface of the main frame 51.

The width of the second part 51 b may be smaller than that of the firstpart 51 b.

The second part 51 b may protrude on the first part 51 a by a firstlength L. When the bottom of the first part 51 a is disposed on the samehorizontal surface as the bottom of the body 10, the second part 51 bmay protrude on the bottom of the body 10 by the first length L.

Since the second part 51 b protrudes on the bottom of the body 10 by thefirst length L, the second part 51 b is excellent in physical couplingor thermal coupling with a substrate or a support member where the lightemitting apparatus 1 is installed and may rapidly discharge the heatgenerated from the light emitting apparatus 1 to the outside.

The first and second sub frames 52 and 53 extend on the main frame 51 tobe exposed toward the side of the body and the first and second subframes 52 and 53 may protrude on the side of the body 10.

The first and second sub frames 52 and 53 include an inclined surfaceinclined upwards from the main frame 51 and ends of the first and secondsub frames 52 and 53 may be formed in parallel to the bottom of the body10 or the main frame 51.

The heat radiating member 50 may be made of a material having highthermal conductivity, i.e., metal, resin, and the like and it is notlimited thereto.

Hereinafter, the operation of the heat radiating member 50 of the lightemitting apparatus 1 will be described in detail.

FIG. 5 is a cross-sectional view of a light unit including the lightemitting apparatus and FIGS. 6 and 7 are perspective views of a lightunit including the light emitting apparatus.

Referring to FIGS. 5 to 7, the light unit includes the light emittingapparatus 1 and a substrate 60 equipped with the light emittingapparatus 1. Further, the light unit may include a support member 80where the substrate 60 is disposed.

The support member 80 may be variously changed depending on the usage ofthe light emitting apparatus 1. For example, when the light emittingapparatus 1 is used in the backlight unit, the support member may be abottom cover. Further, when the light emitting apparatus 1 is used inthe lighting device, the support member may be a lighting case.

In particular, when the light emitting apparatus 1 is used in abacklight unit, the substrate 60 may be disposed on at least one innersurface of the support member 80 as shown in FIG. 6 or may be disposedon the bottom of the support member 80 as shown in FIG. 7. However, itis not limited thereto.

The substrate 60 may include, for example, a printed circuit board(PCB), a flexible printed circuit board (FPCB), and the like.

The substrate 60 may include an insulation layer 61 and a circuitpattern 62 disposed on at least one surface of the insulation layer 61.Further, the substrate 60 may include a through-hole 64. Thethrough-hole 64 penetrates the insulation layer 61 to allow the supportmember 80 to be exposed.

When the circuit pattern 62 is formed on the top and the bottom of theinsulation layer 61, the through-hole 64 may be plated with a conductivematerial to electrically connect the circuit patterns 62 of the top andbottom of the insulation layer 61 to each other. However, thethrough-hole 64 may not include the conductive material and is notlimited thereto.

The heat radiating member 50 that protrudes on the bottom of the body 10of the light emitting apparatus 1 is inserted into the through-hole 64to contact the support member 80. At this time, the first and secondelectrodes 31 and 32 exposed on the outer bottom of the body 10 may beelectrically connected with the circuit pattern 62.

That is, the heat radiating member 50 protrudes on the bottom of thebody 10 by the first length L. In this case, the first length L may be alength to allow the heat radiating member 50 to be inserted into thethrough-hole 64 to contact the support member 80 and the firstelectrodes 31 and 32 to be electrically connected with the circuitpattern 62. For example, the first length L may be in the range of 0.1to 3 mm.

Since the heat radiating member 50 may contact the support member 80,the heat generated from the light emitting apparatus 1 is effectivelytransferred to the support member 80 through the heat radiating member50 to be discharged.

The light emitting device 20 may be disposed in the cavity 15. At thistime, the light emitting device 20 may be mounted on the heat radiatingmember 50.

The light emitting device 20 is electrically connected with the firstand second electrodes 31 and 32 and generates light by using electricpower received from the first and second electrodes 31 and 32.

The light emitting device 20 may be red, green, blue, or white lightemitting diode that generates red, green, blue, or white light or may bea UV light emitting diode that generates ultraviolet rays. The type ofthe light emitting device 20 is not limited.

Further, the light emitting apparatus 1 may include the plurality oflight emitting device 20 and for example, may include light emittingdiodes that emit red, green, and blue colors constituting three primarycolors of light. Further, the plurality of light emitting devices 20 mayall adopt light emitting diodes of the same color or may include lightemitting diodes having various colors and it is not limited thereto.

The light emitting device 20 may be electrically connected with thefirst and second electrodes 31 and 32 by a wire as shown in the figure.However, the light emitting device 20 may be electrically connected withthe first and second electrodes 31 and 32 by a die bonding method, aflip chip method, and the like in addition to the wire method and is notlimited thereto.

The encapsulant 40 may be formed in the cavity 15 to seal the lightemitting device 20.

The encapsulant 40 may protect the light emitting device 20 and mayadjust light distribution of the light emitted from the light emittingdevice 20. Further, the phosphor luminescent substance is included inthe encapsulant 40 to adjust the color sense of the light.

Further, a lens (not shown) may be further formed on the body 10. Thelens (not shown) may adjust the color sense or light distribution of thelight emitted from the light emitting device 20.

FIG. 8, as another embodiment of the light unit, is a diagramillustrating a case in which the light emitting apparatus 1 is mountedon a metal core printed circuit board (MCPCB) 70.

Referring to FIG. 8, the light unit includes the light emittingapparatus 1, the MCPCB 70 equipped with the light emitting apparatus 1,and the support member 80 where the MCPCB 70 is disposed.

The MCPCB 70 may include a metallic layer 71, an insulation layer 72formed on the metallic layer 71, and a circuit pattern 73 formed on theinsulation layer 72.

Further, the MCPCB 70 may include a through-hole 74 of which at least apart of the metallic layer 71 is exposed by selectively removing theinsulation layer 72.

The heat radiating member 50 that protrudes on the bottom of the body 10of the light emitting apparatus 1 is inserted into the through-hole 74to contact the metallic layer 71. At this time, the first and secondelectrodes 31 and 32 exposed on the outer bottom of the body 10 may beelectrically connected with the circuit pattern 73.

That is, the heat radiating member 50 protrudes on the bottom of thebody 10 by the first length L. In this case, the first length L may be alength to allow the heat radiating member 50 to be inserted into thethrough-hole 74 to contact the metallic layer 71 and the firstelectrodes 31 and 32 to be electrically connected with the circuitpattern 73. For example, the first length L may be in the range of 0.1to 3 mm.

Since the heat radiating member 50 contacts the metallic layer 71 andthe metallic layer 71 is disposed on the support member 80, the heatgenerated from the light emitting apparatus 1 is effectively transferredto the support member 80 through the heat radiating member 50 to bedischarged.

Hereinafter, a light emitting apparatus 1A according to a secondembodiment will be described in detail by focusing on componentsthereof. In the describing the second embodiment, the same part as thefirst embodiment will refer to the first embodiment and a duplicateddescription will be omitted. The light emitting apparatus 1A accordingto the second embodiment is similar to the light emitting apparatus 1according to the first embodiment except for the structure of the firstand second electrodes.

FIG. 9 is a cross-sectional view of a light emitting apparatus 1Aaccording to a second embodiment.

Referring to FIG. 9, the light emitting apparatus 1A includes a body 10including a cavity 15, a light emitting device 20 in the body 10, afirst electrode 31 a and a second electrode 32 a of which ends aredisposed in the body and which are electrically connected with the lightemitting device 20, a heat radiating member 50 thermally connected withthe light emitting device 20, of which at least a part protrudes fromthe bottom of the body 10, and an encapsulant 40 formed in the cavity 15to seal the light emitting device 20. A phosphor luminescent substancemay be added to the encapsulant 40.

The cavity 15 may not include the stepped section of the firstembodiment.

The one end of each of the first and second electrodes 31 a and 32 a maybe disposed in the body 10 and the other end of each of the first andsecond electrodes 31 a and 32 a may be exposed through the outer surfaceor/and the bottom of the body 10.

The heat radiating member 50 supports the light emitting device 20 andreceives heat generated from the light emitting device 20. In addition,the heat radiating member 50 protrudes on the bottom of the body 10 by afirst length L to be connected with a substrate or a support member soas to easily transfer heat to the substrate or the support member.Therefore, the heat generated from the light emitting apparatus 1 mayeffectively emit the substrate or the support member.

Hereinafter, a light emitting apparatus 1B according to a thirdembodiment will be described in detail by focusing on componentsthereof. In the describing the third embodiment, the same part as thefirst embodiment will refer to the first embodiment and a duplicateddescription will be omitted. The light emitting apparatus 1B accordingto the third embodiment is similar to the light emitting apparatus 1according to the first embodiment except for the structures of the firstand second electrodes and the heat radiating member.

FIG. 10 is a cross-sectional view of a light emitting apparatus 1Baccording to a third embodiment.

Referring to FIG. 10, the light emitting apparatus 1B includes a body 10including a cavity 15, a light emitting device 20 in the body 10, afirst electrode 31 b and a second electrode 32 b of which ends aredisposed in the body 10 and which are electrically connected with thelight emitting device 20, a heat radiating member 50 a formed on thebottom of the body 10, at least one heat conducting via 55 thermallyconnecting the light emitting device 20 and the heat radiating member 50a with each other, and an encapsulant 40 formed in the cavity 15 to sealthe light emitting device 20. A phosphor luminescent substance may beadded to the encapsulant 40.

The light emitting device 20 may be mounted on any one of the first andsecond electrode 31 b and 32 b.

The one end of each of the first and second electrodes 31 b and 32 b iselectrically connected with the light emitting device 20 and the otherend of each of the first and second electrodes 31 b and 32 b iselectrically connected with a substrate equipped with the light emittingdevice 20, and the like to transfer electric power to the light emittingdevice 20.

The heat radiating member 50 a may be formed on the bottom of the body10 and the height of the heat radiating member 50 a may be a firstlength L which is in the range of 0.1 to 3 mm. The heat radiating member50 a contacts a substrate or a support member to effectively emit heatgenerated from the light emitting apparatus 1 to the substrate or thesupport member.

The heat conducting via 55 may thermally connect the heat radiatingmember 50 a with the electrodes 31 b and 32 b equipped with the lightemitting device 20. The heat conducting via 55 may form at least one viahole penetrating the body 10 and may be formed by filling the via holewith a material having high thermal conductivity. The material havinghigh thermal conductivity may be, for example, thermal conductivefiller, a thermal conductive adhesive, metal, and the like, but is notlimited thereto.

Hereinafter, a light emitting apparatus 1C according to a fourthembodiment will be described in detail by focusing on componentsthereof. In the describing the fourth embodiment, the same part as thefirst embodiment will refer to the first embodiment and a duplicateddescription will be omitted. The light emitting apparatus 1C accordingto the fourth embodiment is similar to the light emitting apparatus 1according to the first embodiment except for the existence or not of theencapsulant and the optical film.

FIG. 11 is a cross-sectional view of a light emitting apparatus 1Caccording to a fourth embodiment.

Referring to FIG. 11, the light emitting apparatus 1C includes a body 10including a cavity 15, a light emitting device 20 in the body 10, afirst electrode 31 and a second electrode 32 of which ends are disposedand which are electrically connected with the light emitting device 20,a heat radiating member 50 thermally connected with the light emittingdevice 20, of which at least a part protrudes from the bottom of thebody 10, an encapsulant 40 a formed in the cavity 15 to seal the lightemitting device 20, and an optical film 60 formed on the body 10. Atleast one of the encapsulant 40 a and the optical film 60 includes aphosphor luminescent substance. The optical film 60 is disposed outsideof the cavity 15 to be supported by the body 10.

The cavity 15 may include a stepped section 16. One end of each of thefirst and second electrodes 31 and 32 may be disposed at the steppedsection 16 and the other end of each electrode may be exposed throughthe outer surface or/and the bottom of the body 10.

The heat radiating member 50 supports the light emitting device 20 andreceives heat generated from the light emitting device 20. In addition,the heat radiating member 50 protrudes on the bottom of the body 10 by afirst length L to be connected with a substrate or a support member soas to easily transfer heat to the substrate or the support member.Therefore, the heat generated from the light emitting apparatus 1 mayeffectively emit the substrate or the support member.

The encapsulant 40 a may be formed to seal the light emitting device 20.However, the encapsulant 40 a may not be formed or may not include aphosphor luminescent substance.

The optical film 60 may be formed on the encapsulant 40 a and the body10. The optical film 60 may be, for example, a phosphor luminescent film(PLF), a diffusion film, or the like, but is not limited thereto.

If the optical film 60 is the phosphor luminescent film (PLF), thephosphor luminescent film (PLF) may include the phosphor luminescentsubstance. In addition, the phosphor luminescent substance is excited bythe light emitted from the light emitting device 20 to allow the lightemitting apparatus 1C to have various color senses.

Embodiments may provide a light emitting apparatus and a light unithaving new structures.

Embodiments may provide a light emitting apparatus and a light unithaving improved heat radiation characteristics.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A light emitting device, comprising: a bodyincluding a cavity formed with a stepped section; an electrode of whichone end is disposed on the stepped section and the other end is disposedoutside of the body; a metal layer including a main frame and a subframe extended from the main frame; and a light emitting diode disposedon the metal layer, wherein a bottom surface of the main frame isexposed out from a bottom surface of the body, wherein a portion of atop surface of the main frame is exposed to the cavity, and wherein anarea of the top surface of the main frame is larger than an area of thebottom surface of the main frame.
 2. The light emitting device of claim1, wherein the stepped section is formed on the inner surface of thebody forming the cavity.
 3. The light emitting device of claim 1,wherein the sub frame includes a slope being inclined upwards from abottom surface of the body.
 4. The light emitting device of claim 1,wherein the metal layer includes a metallic material.
 5. The lightemitting device of claim 1, further comprising an encapsulant disposedin the cavity.
 6. The light emitting device of claim 5, wherein theencapsulant includes a phosphor material.
 7. The light emitting deviceof claim 1, wherein a portion of the metal layer is protruded from abottom surface of the body.
 8. The light emitting device of claim 1,wherein the electrode includes a first surface and a second surface, andthe first surface is disposed higher than the second surface.
 9. Thelight emitting device of claim 1, wherein the metal layer is coupledwith the body.
 10. A light unit, comprising: a light emitting devicecomprising a body including a cavity formed with a stepped section, anelectrode of which one end is disposed on the stepped section and theother end is disposed outside of the body, a metal layer including amain frame and a sub frame extended from the main frame, and a lightemitting diode disposed on the metal layer, wherein a bottom surface ofthe main frame is exposed out from a bottom surface of the body, whereina portion of a top surface of the main frame is exposed to the cavity,and wherein an area of the top surface of the main frame is larger thanan area of the bottom surface of the main frame; a substrate disposedunder the light emitting device, wherein at least a portion of the metallayer is disposed inside the substrate.
 11. The light unit of claim 10,wherein the substrate includes an insulation layer with a through-holeand a circuit pattern disposed on the insulation layer and at least theportion of the metal layer is inserted into the through-hole.
 12. Thelight unit of claim 10, wherein the substrate includes a metallic layer,an insulation layer disposed on the metallic layer and having athrough-hole to expose the metallic layer, and a circuit patterndisposed on the insulation layer, and at least the portion of the metallayer is inserted into the through-hole to contact the metallic layer.13. The light unit of claim 10, wherein the stepped section is formed onthe inner surface of the body forming the cavity.
 14. The light unit ofclaim 10, wherein the sub frame includes a slope being inclined upwardsfrom a bottom surface of the body.
 15. The light unit of claim 10,wherein the metal layer includes a metallic material.
 16. The light unitof claim 10, further comprising an encapsulant disposed in the cavity.17. The light unit of claim 16, wherein the encapsulant includes aphosphor material.
 18. The light unit of claim 10, wherein the electrodeincludes a first surface and a second surface, and the first surface isdisposed higher than the second surface.
 19. The light unit of claim 10,wherein the metal layer is coupled with the body.
 20. The light unit ofclaim 10, wherein at least the portion of the metal layer is protrudedfrom a bottom surface of the body.